Description

• Heat resistant protection tape of low contamination
• Acrylic resin adhesive
• Free of organic silicone
• Keep stable adhesive strength after heating
• Protection tape for the metalizing process of Silicon or Sapphire wafers at high temperature

These products consist of a layer of heat resistant adhesive (of low adhesion strength) and a base film of heat resistant and low shrinkage PET or PI, having the advantages of stable adhesive strength and low contamination after heating.

Tape structure
Base film：PET or PI
Adhesive：Acrylic resin series
Liner：OPP