Heat resistant protection tape of low contamination
Acrylic resin adhesive
Free of organic silicone
Keep stable adhesive strength after heating
Protection tape for the metalizing process of Silicon or Sapphire wafers at high temperature
These products consist of a layer of heat resistant adhesive (of low adhesion strength) and a base film of heat resistant and low shrinkage PET or PI, having the advantages of stable adhesive strength and low contamination after heating.
Tape structure
Base film:PET or PI
Adhesive:Acrylic resin series
Liner:OPP
Features
PI tape are durable against 260℃,1Hr
Low adhesive strenght
Easy to peel off
Stable adhesive strength after heating
Excellent chemical resistance
Excellent dimension stability
Reasonable price
Application
Carrier tape for the processing of wafers , OLED panel , thin glass or thin film
Specification
A lot of grades for selection , please contact us directly for the further information